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Brand Name: | HYM |
Model Number: | FS09 |
MOQ: | 1000 Pieces |
Price: | $0.1-$0.5/Piece |
Delivery Time: | 60 work days |
Payment Terms: | L/C, D/A, D/P, T/T |
Electronics industry:
Electronic product casings: The casing parts of electronic products such as mobile phones, computers, and cameras often adopt plastic secondary molding technology. For example, through secondary molding processes such as two-color injection molding, the casing can have different colors, textures or glosses, increasing the aesthetics and recognition of the product. At the same time, secondary molding can also add some special functional structures on the casing, such as anti-slip patterns and heat dissipation holes.
Electronic component packaging: For some small electronic components such as sensors and connectors, plastic secondary molding technology will also be used for their packaging casings. Secondary molding can provide good protection and insulation performance for electronic components, and at the same time ensure the dimensional accuracy and stability of the components.
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Brand Name: | HYM |
Model Number: | FS09 |
MOQ: | 1000 Pieces |
Price: | $0.1-$0.5/Piece |
Packaging Details: | Plastic Bag And Boxes Standard Or Customized |
Payment Terms: | L/C, D/A, D/P, T/T |
Electronics industry:
Electronic product casings: The casing parts of electronic products such as mobile phones, computers, and cameras often adopt plastic secondary molding technology. For example, through secondary molding processes such as two-color injection molding, the casing can have different colors, textures or glosses, increasing the aesthetics and recognition of the product. At the same time, secondary molding can also add some special functional structures on the casing, such as anti-slip patterns and heat dissipation holes.
Electronic component packaging: For some small electronic components such as sensors and connectors, plastic secondary molding technology will also be used for their packaging casings. Secondary molding can provide good protection and insulation performance for electronic components, and at the same time ensure the dimensional accuracy and stability of the components.
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